COPPER ALLOY DATA SHEET
C10100
and C10200
With compositions of 99.99% minimum copper
and 99.95% minimum copper including silver and oxygen contents of 5 ppm and 10
ppm maximum respectively, Oxygen-Free, High Conductivity Coppers C10100
(electronic grade) and C10200 (regular grade) are undoubtedly the purest
coppers commercially available. They
offer a unique set of properties. For
example, their freedom from oxygen, and their name
implies, gives them immunity to hydrogen embrittlement when exposed to elevated
temperatures under reducing conditions.
This distinguishes them from electrolytic tough pitch (ETP) C11000
copper whose typical oxygen content of 400 ppm results in susceptibility to hydrogen
embrittlement. Their freedom from
deoxidizing elements and impurities in general ensures a consistently, high
electrical conductivity exceeding 100% IACS.
Hot Working: Both
C10100 and C10200 have excellent hot workability. They can be readily hot extruded using very
high reductions. They can also be
readily forged, and the amount of reduction per pass should be as large as
possible, particularly in the initial passes.
The time and temperature of heating prior to hot working should be
minimized. A uniform temperature should
be achieved throughout the work piece. Heating
should be preferably done in a reducing or neutral atmosphere.
Cold Working: Both C10100
and C10200 have excellent cold workability.
They can be readily cold drawn with high reductions between annealing
cycles. Annealing should be performed in
a reducing or neutral atmosphere. High temperatures
should also be avoided to minimize grain growth.
Joining and Fabrication: Joining by soldering and brazing is
excellent. Due to their very low oxygen
contents and overall low impurities, both coppers can be readily welded using
the shielded arc processes.
Applications: C10100
and C10200 coppers are typically used in applications where the presence of
oxygen is detrimental. In particular,
C10100, with its strictly held low levels of impurities, is used for more
critical conditions such as high-vacuum conditions where low volatility of
impurities is essential. Both coppers
also form a tight, adherent, oxide scale, which is advantageous
for glass-to-metal seals. The coppers
are particularly noted for their excellent dimensional stability when heated in
hydrogen, having low coefficients of expansion over a broad temperature range.
Due to their high electrical conductivity,
toughness and ductility, C10100 and C10200 are used in electronic applications
such as coaxial cables, computer hook-up wire, heat sinks for diodes,
rectifiers, and other components, lead wire for circuit breakers and modules,
microwave equipment, radar components, solderless connectors and wave guides. Electrical applications include armature
windings, bus bars, cold-headed parts such as
connector pins, flexible shunts, motor and generator windings, collector rings,
switches, contacts, and transformer coil windings.
Applicable Specifications: When so specified, C10100 and C10200 will be
manufactured to the latest revision of the following specifications: ASTM Specifications B49, B187, and F68 for
rod; B1, B2, B3, B33, B48, B189, B246, B272, B298, B355, and F68 for wire;
B187, and F68 for shapes; and B75, B188, B372, and F68 for tube.
Standard Forms Available: Rod, bar, wire, shapes and tube. For other forms, please contact Ansonia
Copper & Brass, Inc.
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ADS No. C10100 & C10200 |
Rev. No. 2 |
Rev. Date |
C10100C10200 |
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Tel.: 1-800-521-1703 FAX 203-735-3787 |
Tel.: 1-800-243-3204 FAX 203-756-1330 |
PROPERTIES
OF C10100 and C10200 
Nominal Composition:
C10100 99.99% minimum copper with maximum limits in parts per million (ppm) for the following impurities: antimony 4, arsenic 5, bismuth 1, cadmium 1, iron 10, lead 5, manganese 0.5, nickel 10, oxygen 5, phosphorus 3, selenium 3, silver 25, sulfur 15, tellurium 2, tin 2, and zinc 1.
C10200 99.95% minimum copper (including silver), 10 ppm maximum oxygen
Physical Properties:
Melting Point (Liquidus): 1083°C (1981°F)
(Solidus): 1083°C (1981°F)
Density
at 68°F: 0.323
Lbs./In.3
Coefficient of Linear Expansion per °F: 9.4 x 10-6 (68-212°F)
9.6 x 10-6 (68-392°F)
9.8 x 10-6 (68-572°F)
Electrical Conductivity at 68°F (volumetric): 101% IACS for C10100
100% IACS for C10200
(in annealed condition; lower in hard temper)
Thermal Conductivity Btu/ft.2/ft./hr./°F at 68°F: 226
Modulus of Elasticity - Tension: 17,000 ksi
Modulus of Rigidity: 6,400 ksi
Fabrication Properties:
Hot Working Temperature: 750-875°C (1400-1600°F)
Annealing Temperature: 375-650°C (700-1200°F)
Approximate Relative Machinability: 20 (free cutting brass arbitrarily rated at 100)
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Mechanical Properties: |
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Rod
|
Tensile Strength (psi) |
Yield Strength (0.5% Ext.) (psi) |
% Elongation (in 2") |
Rockwell Hardness |
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0.250" Dia. Hard (20%) H04 |
55,000 |
50,000 |
10 |
HRB 60 |
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1.000" Dia. As Hot Rolled M30 |
32,000 |
10,000 |
55 |
HRF 40 |
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1.000" Dia. 0.050 mm OS050 |
32,000 |
10,000 |
55 |
HRF 40 |
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1.000" Dia. Hard (35%) H04 |
48,000 |
44,000 |
16 |
HRB 47 |
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2.000" Dia. Hard (16%) H04 |
45,000 |
40,000 |
20 |
HRB 45 |
Wire
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0.080" Dia. 0.050 mm OS050 |
35,000 |
-- |
35 (in 10") |
-- |
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0.080" Dia. Hard H04 |
55,000 |
-- |
-- |
-- |
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0.080" Dia. Spring H08 |
66,000 |
-- |
-- |
-- |
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ADS No. C10100 & C10200 |
Rev. No. 2 |
Rev. Date 6/23/99 |
C10100C10200 |
The
statements and data provided on this data sheet are to be considered only as a
general guide. Commercial variations in
material properties are expected, so values listed here are not intended to be
used for specifications. Please consult
the appropriate industry specifications where applicable. Ansonia Copper & Brass, Inc. also cannot
assume responsibility for performance of these products in service because we
do not control or supervise subsequent use of our products.